Special Offers

Special Offers

The World First PCIe 4.0x4 Controller, Phison PS5016-E16 controller, made by 28nm manufacturing technology. The advanced fabrication process ensures PS5016-E16 has enough compute power for ECC processing when adopting the latest 3D TLC NAND flash. PS5016-E16 also features eight NAND channels with 32 CE targets, DDR4 DRAM caching, and a PCIe 4.0x4 interface. As for features, the chip supports the NVMe 1.3 protocol, LDPC error correction, and Wear Leveling, Over-Provision technologies to improve reliability and durability of SSDs

GP ASM2NE6500GTTD
GIGABYTE
2,300.00EGP
Home Storage Hard Drive
  • Form Factor: M.2 2280
  • Interface: PCI-Express 4.0 x4, NVMe 1.3
  • Total Capacity: 500GB*
  • Sequential Read Speed : up to 5000 MB/s**
  • Sequential Write speed : up to 2500 MB/s**
  • Wear Leveling, Over-Provision technologies
  • TRIM & S.M.A.R.T supported
  • Fully Body Copper Heat Spreader

NAND Flash Selected for High Quality and Performance

TOSHIBA BiCS4 96 Layers 3D TLC (800MT/s)

Toshiba BiCS4 NAND Flash optimizes circuitry and architecture by increasing to 96 layers for higher storage space per unit area. 800MT/s throughput on the AORUS NVMe Gen 4 SSD far exceeds that of PCIe 3.0x4 devices for superior storage performance.

Xtreme Storage Performance

With the new PCIe 4.0 controller, AORUS NVMe Gen 4 SSD delivers blazing speeds: up to 5,000 MB/s for sequential read, and up to 2,500MB/s sequential write. Sequential Read performance of PCIe 4.0 SSDs is up to 40% faster than PCIe 3.0 SSDs. Get ready to enter the next generation of computing with faster and smoother, gaming, streaming, and graphics intensive rendering.

Full Body Copper Thermal Solution for Outstanding PCIe 4.0 SSD Performance

The Full Body Copper Heatsink takes into account the heat transfer from key components on both the front and back of the device, the controller and NAND Flash. Full copper heatsinks have 69% higher heat transfer capacity compared to aluminum heatsinks giving AORUS NVMe Gen4 SSD the best heat dissipation for read/write performance.

Efficient Copper Heat Spreader Design

Compared with a plated M.2 heat spreader, new efficient copper heat spreaders with 27 fins add more surface area which improve thermal transfer from heating sources to obtain thermal balance sooner. Moreover, Optimized fin array design does great heat exchange with any direction of air flow. Both unique design make sure key components of PCIe 4.0 SSD to keep suitable working temperature under ultra high transfer rate.

Brand GIGABYTE
Model AORUS NVMe Gen4 SSD 500GB
Interface PCI-Express 4.0x4, NVMe 1.3
Form Factor M.2 2280
Total Capacity 500GB
NAND 3D TLC Toshiba BiCS4
External DDR Cache DDR4 512MB
Sequential Read speed Up to 5000 MB/s
Sequential Write speed Up to 2500 MB/s
Random Read IOPS up to 400k
Random Write IOPS up to 550k
Mean time between failure (MTBF) 1.77 million hours
Power Consumption (Active) Average: R : 5.9W; W : 4.5W
Power Consumption (Idle) 13.21mW
Temperature (Operating) 0°C to 70°C
Temperature (Storage) -40°C to 85°C
Dimension 80.5 x 11.4 x 23.5 mm
Warranty 3 year
GP ASM2NE6500GTTD

Data sheet

Brand
GIGABYTE
Model
AORUS NVMe Gen4 SSD 500GB
Interface
PCI-Express 4.0x4, NVMe 1.3
Temperature Operating
0°C to 70°C
Dimensions
80.5 x 11.4 x 23.5 mm
Power consumption
Average: R : 5.9W; W : 4.5W
Capacity
500GB
Warranty
3 year
Storage Temperature
-40°C to 85°C
Form factor
M.2 2280
Sequential Read
Up to 5000 MB/s
Sequential Write
Up to 2500 MB/s

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