Special Offers

Special Offers

GIGABYTE B760M D2H Motherboards are ready to work with the PCIe 4.0 devices which are expected to experience triple bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.

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B760M D2H DDR4 (rev. 1.0)
GIGABYTE
5,111.00EGP
Quantity
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Specs

  • Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors
  • Unparalleled Performance:Hybrid 6+2+1 Phases Digital VRM Solution
  • Dual Channel DDR4:2*DIMMs XMP Memory Module Support
  • Next Generation Storage:2*PCIe 4.0 x4 M.2 Connectors
  • EZ-Latch:PCIe 4.0x16 Slot with Quick Release Design
  • Fast Networks:2.5GbE LAN
  • Extended Connectivity:HDMI, D-Sub
  • Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
  • Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card
BrandGIGABYTE™
ModelB760M D2H DDR4 (rev. 1.0)
CPULGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors
L3 cache varies with CPU
ChipsetIntel® B760 Express Chipset
MemorySupport for DDR4 5333(O.C.)/ 5133(O.C.)/ 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.)/ 4133(O.C.)/ 4000(O.C.)/ 3866(O.C.)/ 3800(O.C.)/ 3733(O.C.)/ 3666(O.C.)/ 3600(O.C.)/ 3466(O.C.)/ 3400(O.C.)/ 3333(O.C.)/ 3300(O.C.)/ 3200/ 3000/ 2933/ 2666/ 2400/ 2133 MT/s memory modules
2 x DDR4 DIMM sockets supporting up to 64GB (32 GB single DIMM capacity) of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
Onboard GraphicsIntegrated Graphics Processor-Intel® HD Graphics support:
1 x D-Sub port, supporting a maximum resolution of 1920x1200@60 Hz
1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz
Audio

Realtek® Audio CODEC
High Definition Audio
2/4/5.1/7.1-channel
Support for S/PDIF Out
LANRealtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
Expansion SlotsCPU:1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16
Chipset:2 x PCI Express x1 slots, supporting PCIe 3.0 and running at x1
Storage Interface

CPU:1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)
Chipset:1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
4 x SATA 6Gb/s connectors
USBChipset:6 x USB 3.2 Gen 1 ports (4 ports on the back panel, 2 ports available through the internal USB header)
4 x USB 2.0/1.1 ports (2 ports on the back panel, 2 ports available through the internal USB header)
Chipset+2 USB 2.0 Hubs:
4 x USB 2.0/1.1 ports available through the internal USB headers
Internal I/O Connectors1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
2 x system fan headers
1 x addressable LED strip header
1 x RGB LED strip header
2 x M.2 Socket 3 connectors
4 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x S/PDIF Out header
1 x USB 3.2 Gen 1 header
3 x USB 2.0/1.1 headers
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
1 x serial port header
1 x Q-Flash Plus button
1 x reset button
1 x reset jumper
1 x Clear CMOS jumper
Back Panel Connectors1 x PS/2 keyboard/mouse port
1 x D-Sub port
1 x HDMI port
4 x USB 3.2 Gen 1 ports
2 x USB 2.0/1.1 ports
1 x RJ-45 port
3 x audio jacks
I/O ControlleriTE® I/O Controller Chip
Unique FeaturesSupport for GIGABYTE Control Center (GCC)
Support for Q-Flash
Support for Q-Flash Plus
Bundled SoftwareNorton® Internet Security (OEM version)
LAN bandwidth management software
Operating SystemSupport for Windows 11 64-bit
Support for Windows 10 64-bit
Form FactorMicro ATX Form Factor; 24.4cm x 22.5cm
Warranty12 month
B760M D2H DDR4 (rev. 1.0)
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Data sheet

Brand
GIGABYTE™
Model
B760M D2H DDR4 (rev. 1.0)
Processor
LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors L3 cache varies with CPU
VGA
Integrated Graphics Processor-Intel® HD Graphics support: 1 x D-Sub port, supporting a maximum resolution of 1920x1200@60 Hz 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz
I/O Ports
CPU:1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 Chipset:2 x PCI Express x1 slots, supporting PCIe 3.0 and running at x1
USB
Chipset+2 USB 2.0 Hubs: 4 x USB 2.0/1.1 ports available through the internal USB headers
Chipset:6 x USB 3.2 Gen 1 ports (4 ports on the back panel, 2 ports available through the internal USB header) 4 x USB 2.0/1.1 ports (2 ports on the back panel, 2 ports available through the internal USB header)
Operating System
Support for Windows 11 64-bit Support for Windows 10 64-bit
Chipset
Intel® B760 Express Chipset
Memory
2 x DDR4 DIMM sockets supporting up to 64GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture
3666(O.C.)/ 3600(O.C.)/ 3466(O.C.)/ 3400(O.C.)/ 3333(O.C.)/ 3300(O.C.)/ 3200/ 3000/ 2933/ 2666/ 2400/ 2133 MT/s memory modules
Support for DDR4 5333(O.C.)/ 5133(O.C.)/ 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.)/ 4133(O.C.)/ 4000(O.C.)/ 3866(O.C.)/ 3800(O.C.)/ 3733(O.C.)/
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules
Lan
Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
Storage
4 x SATA 6Gb/s connectors
CPU:1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU) Chipset:1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
Audio
Realtek® Audio CODEC High Definition Audio 2/4/5.1/7.1-channel Support for S/PDIF Out
Warranty
12 month
Form factor
Micro ATX Form Factor; 24.4cm x 22.5cm