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MB GIGABYTE™ Intel® B365M-H
لوحة أم فائقة التحمل Intel B365 مع GIGABYTE 8118 Gaming LAN و PCIe Gen3 x4 M.2 ومقاومة ضد الكبريت ومروحة ذكية 5 و CEC 2019 جاهزة
B365M-H
· يدعم الجيل التاسع والثامن من معالجات Intel® Core ™
· ذاكرة DDR4 مزدوجة القناة غير مزودة بنظام تصحيح الأخطاء (ECC)
· تصميم رقمي هجين جديد PWM
· مكثفات صوتية عالية الجودة وخاصية منع التشوش الصوتى مع إضاءة LED بمسار التتبع
· بطاقة M.2 فائقة السرعة مع واجهة PCIe Gen3 X4 و SATA
· شبكة LAN الحصرية للألعاب 8118 من جيجابايت مع إدارة النطاق الترددي
· CEC 2019 جاهز ، وفر الطاقة بسهولة بنقرة واحدة
· تتميز Smart Fan 5 بمستشعرات حرارة متعددة ووصلات هجينة للمروحة مع FAN STOP
· تصميم المقاومات المضادة للكبريت
· خاصية التحمل الفائق ™ 15KV Surge LAN Protection
· ذاكرة Intel® Optane ™ جاهزة
| GIGABYTE | الماركه |
| Intel® B365M-H | الموديل |
| Support for 9th and 8th Generation Intel® Core™ i9 processors/Intel® Core™ i7 processors/Intel® Core™ i5 processors/Intel® Core™ i3 processors/Intel® Pentium® processors/Intel® Celeron® processors in the LGA1151 package | وحده المعالجه المركزيه |
| L3 cache varies with CPU | |
| Intel® B365 Express Chipset | الشرائح |
| 2 x DDR4 DIMM sockets supporting up to 32 GB of system memory | الذاكره |
| Dual channel memory architecture | |
| Support for DDR4 2666/2400/2133 MHz memory modules | |
| Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) | |
| Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules | |
| Support for Extreme Memory Profile (XMP) memory modules | |
| Integrated Graphics Processor-Intel® HD Graphics support: | الجيرافيك المدمج |
| 1 x D-Sub port, supporting a maximum resolution of 1920x1200@60 Hz | |
| 1 x HDMI port, supporting a maximum resolution of 4096x2160@30 Hz | |
| Realtek® ALC887 codec | الصوت |
| High Definition Audio | |
| 2/4/5.1/7.1-channel | |
| Realtek® GbE LAN chip (10/100/1000 Mbit) | LAN |
| 1 x PCI Express x16 slot, running at x16 | فتحات التوسعه |
| 1 x PCI Express x1 slot | |
| Chipset:1 x M.2 connector (Socket 3, M key, type 2242/2260/2280 SATA and PCIe x4/x2 SSD support) | واجهه التخزين |
| 4 x SATA 6Gb/s connectors | |
| Support for RAID 0, RAID 1, RAID 5, and RAID 10 | |
| Chipset:6 x USB 3.1 Gen 1 ports (4 ports on the back panel, 2 ports available through the internal USB header) | يو اس بي |
| 6 x USB 2.0/1.1 ports (2 ports on the back panel, 4 ports available through the internal USB headers) | |
| 1 x 24-pin ATX main power connector | موصلات الإدخال / الإخراج الداخلية |
| 1 x 8-pin ATX 12V power connector | |
| 1 x CPU fan header | |
| 1 x system fan header | |
| 1 x M.2 Socket 3 connector | |
| 4 x SATA 6Gb/s connectors | |
| 1 x front panel header | |
| 2 x USB 2.0/1.1 headers | |
| 1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only) | |
| 1 x serial port header | |
| 1 x Clear CMOS jumper | |
| 1 x PS/2 mouse port | موصلات اللوحة الخلفية |
| 1 x PS/2 keyboard port | |
| 1 x D-Sub port | |
| 1 x HDMI port | |
| 4 x USB 3.1 Gen 1 ports | |
| 2 x USB 2.0/1.1 ports | |
| 1 x RJ-45 port | |
| 3 x audio jacks | |
| iTE® I/O Controller Chip | وحدة تحكم الإدخال / الإخراج |
| Voltage detection | H/W Monitoring |
| Temperature detection | |
| Fan speed detection | |
| Overheating warning | |
| Fan fail warning | |
| Fan speed control | |
| 1 x 128 Mbit flash | BIOS |
| Use of licensed AMI UEFI BIOS | |
| PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 | |
| Support for APP Center | الخصائص المميزه |
| @BIOS | |
| AutoGreen | |
| Cloud Station | |
| EasyTune | |
| Easy RAID | |
| Fast Boot | |
| Game Boost | |
| ON/OFF Charge | |
| Platform Power Management | |
| RGB Fusion | |
| Smart Backup | |
| Smart Keyboard | |
| Smart Survey | |
| System Information Viewer | |
| USB Blocker | |
| Support for Q-Flash | |
| Support for Xpress Install | |
| Support for Windows 10 64-bit | نظام التشغيل |
| Micro ATX Form Factor; 22.6cm x 18.5cm | عامل الشكل |
| 36 month | الضمان |
B365M-H
البيانات
- العلامة التجارية
- GIGABYTE
- الموديل
- Intel® B365M-H
- البروسيسور
- Support for 9th and 8th Generation Intel® Core™ i9 processors/Intel® Core™ i7 processors/Intel® Core™ i5 processors/Intel® Core™ i3 processors/Intel® Pentium® processors/Intel® Celeron® processors in the LGA1151 package
- كارت الشاشة
- 1 x D-Sub port, supporting a maximum resolution of 1920x1200@60 Hz
1 x HDMI port, supporting a maximum resolution of 4096x2160@30 Hz
Integrated Graphics Processor-Intel® HD Graphics support: - منافذ التوصيل
- 1 x 8-pin ATX 12V power connector
1 x 24-pin ATX main power connector
1 x CPU fan header
1 x Clear CMOS jumper
1 x M.2 Socket 3 connector
1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
1 x front panel header
1 x serial port header
1 x system fan header
2 x USB 2.0/1.1 headers
4 x SATA 6Gb/s connectors - USB
- 6 x USB 2.0/1.1 ports (2 ports on the back panel, 4 ports available through the internal USB headers)
Chipset:6 x USB 3.1 Gen 1 ports (4 ports on the back panel, 2 ports available through the internal USB header) - متطلبات نظام التشغيل
- Support for Windows 10 64-bit
- شريحة المعالجة
- Intel® B365 Express Chipset
- الذاكرة
- 2 x DDR4 DIMM sockets supporting up to 32 GB of system memory
Dual channel memory architecture
Support for DDR4 2666/2400/2133 MHz memory modules
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for Extreme Memory Profile (XMP) memory modules
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules - Lan
- Realtek® GbE LAN chip (10/100/1000 Mbit)
- Storage
- 4 x SATA 6Gb/s connectors
Chipset:1 x M.2 connector (Socket 3, M key, type 2242/2260/2280 SATA and PCIe x4/x2 SSD support)
Support for RAID 0, RAID 1, RAID 5, and RAID 10 - منفذ البطاقة
- 1 x PCI Express x1 slot
1 x PCI Express x16 slot, running at x16 - الصوت
- 2/4/5.1/7.1-channel
High Definition Audio
Realtek® ALC887 codec - Form factor
- Micro ATX Form Factor; 22.6cm x 18.5cm
- الضمان
- 36 month
